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科研人员

吉元    研究员 硕士生导师

       研究员,1975年毕业于北京工业大学机械系。1975~1985先后在北京工业大学材料学院显微分析中心和固体微结构与性能研究所工作。1985~1987在德国Muenster大学物理所从事扫描电子显微学及电子探针X-射线显微分析。2000年在德国Wuppertal大学电子工程所从事微电子和光电子器件的扫描热成像和声成像研究。主要研究方向:扫描电子显微学、电子显微分析技术和功能开发,包括in-situSEM/ESEM,电子背散射衍射(EBSD)及阴极荧光(CL)技术,成像衬度及机理,荷电补偿技术等。主要涉及半导体结构、微电子和光电子器件,纳米及复合材料等。
主要学术成果
2011
1. Y.Ji, L.Wang, Y.Q.Zhang, B.Wei, J.H.Wang, Y.L.Cheng, H.L.Suo, Distinguishing crystallographicmisorientations of lanthanum zirconate epilayers on nickel substrates by electron backscatter diffraction, Ultramicroscopy, 111, 314–319 (2011).

2009
2. L.Wang, Y.Ji, B.Wei, Y.Q.Zhang, J.Y.Fu, X.D.Xu, X.D.Han, Charge compensation by in-situ heating for insulating ceramics in scanning electron microscope, Ultramicroscopy,109,1326-32 (2009).
3.  Y.F. Zhang, L.Wang, Y. Ji, X.D. Han, Z. Zhang,R. Heiderhoff, A.-K.Tiedemann, L. J. Balk,
Thermal Conductivity Studies of a GaN-Sapphire Structure by Combined Scanning Thermal
Microscopy and ElectronBackscatter Diffraction, IEEE Proceedings of 16th IPFA-2009, China.

2008
4. 田彦宝, 吉 元, 赵跃, 吴迪, 郭霞, 沈光地, 索红莉, 周美玲, GaAs GaN键合界面热应力的电子背散射衍射研究, 人工晶体学报, 37 (5), 1091-1096 (2008).
5.王俊忠, 吉 元, 田彦宝, 牛南辉, 徐晨, 韩军, 郭霞, 沈光地, GaN 外延结构中微区应变场的测量和评价, 电子学报, 36 (11), 2139-2143 (2008).
6. D.X.Wang, Y.Ji, T.X.Zhong, Z.G Li, X.Yang, D.M.Liu, and W.Q.Xiao, Texture Analysis of Damascene Copper Interconnects, JOURNAL OF SEMICONDUCTORS, 29(6) ,1136-1140 (2008)
7. 卫斌, 吉元, 王丽, 张隐奇, 张小玲, 吕长志, 张跃飞, 电子束辐照对氧化锌纳米线I-V 特性的影响, 真空科学与技术学报学报, 28(4), 303-307(2008).

2007
8. 付景永,吉 元等,环境扫描电镜ESEM中电荷环境的测量与评价,真空科学与技术学报,27 (1), 72-75 (2007).
9. Y. Ji, L.Wang, et al. Charge Contrast Imaging of Nonconductive Samples in the High-Vacuum Field Emission Scanning Electron Microscope Scanning 29(5): 230-237 (2007).
10. Y. F. Zhang, X. D. Han, K. Zheng, Z. Zhang, X. N. Zhang, J.Y. Fu, Y. Ji, et al., Direct observation of super-plasticity of beta-SiC nanowires at low temperature, Advanced Functional Materials 17, 3435–3440 (2007)

2006
11. J. F. Luo, Y. Ji, T. X. Zhong, Y. Q. Zhang, et al. EBSD measurements of elastic fields in a GaN/Sapphire structure, Microelectronics Reliability 46, 178-182 (2006).
12. X.L.Quan, Y.Ji, H.Zhang, Y.Q.Zhang, X.D.Xu, T.X.Zhong. Charging Compensation of Alumina Samples by using an Oxygen Micro-Injector in the Environmental Scanning Electron Microscope, Scanning 28, 289-293 (2006).
13. 王俊忠,吉元,王晓冬,刘志民,罗俊锋,李志国,Al互连线和Cu互连线的显微结构,中国物理, 56 (1): 371-375 (2006).
14. J.F. Luo, Y. Ji , T.X. Zhong, Y.Q. Zhang, J.Z. Wang, J.P. Liu, N.H. Niu, J. Han, X. Guo, G.D. Shen, Microelectronics Reliability 46,178-182 (2006)

2005
15. Y.Ji, H.S.Guo, T.X.Zhong, H.Zhang, X.L.Quan, Y.Q.Zhang,X.D.Xu, Charge and Charging Compensation on Oxides and Hydroxides in Oxygen Environmental SEM, Ultramicroscopy 103 (3), 191-198 (2005).
16. 张 虹,吉 元,权雪玲,张隐奇,徐学东,郭汉生,氧环境扫描电子显微分析:消除绝缘材料荷电效应的新方法,真空科学与技术学报25 (5): 344-349(2005).
17. 吉元,张隐奇,权雪玲,张虹,非导电材料的荷电衬度的探讨,电子显微学报24(4),(2005).

2004
18. Y. Ji, T.X. Zhong, Z.G. Li, X.X. Wang, D. Luo, Y. Xia, Z.M. Liu, Grain Structure and Crystallographic Orientation in Cu Damascene Lines, Microelectronic Engineering 71, (2004).
19. Y. Ji, T.X. Zhong, Z.G. Li, X.X. Wang, D. Luo, Z.Y. Qi, Z.M. Liu, Y. Xia, Influence of Damascene Trenches on Grain Growth and Electromigration Behavior of ULSI Lines, Proc. 24th International Conference on Microelectronics (MIEL 2004) Vol 2, Nis, Serbia and Montenegro, 16-19 May (2004).
20. Yuan Ji, Hansheng Guo, V. Kempter, Oxygen Environmental Electron Spectroscopy and Microscopy: A new concept for reducing Harmful electron beam effects on Insulating samples, AVS 51st International Symposium, Anaheim, California, USA. November 14-19 (2004).
21. Y.Ji, H.S.Guo, X.D.Xu, J.X.Shi , T.X.Zhong, A Preliminary Study of Oxygen Environmental SEM: Application on Oxides, Instrumentation Science and Technology, 32 (1): 61-68 (2004).

2003
22. H.S.Guo, W. M. Fredrichs, V. Kempter, Y.Ji, Oxygen Environmental Auger Electeron Spectroscopy: Eliminating the Electron Beam Effects on Al2O3 during Auger Analysis, J. Vacuum Science and Technology, A 21 (4), 1009-1016 (2003).
23. Teck Hock Lee, Xia Guo, Guang-Di Shen, Yuan Ji, Guo-Hong Wang, Jin-Yu Du, Xue-Zhong Wang, Guo Gao, Andreas Altes, Luwig Josef Balk, Investigation of Tunnel-Regenerated Multi-Active-Region Light-Emitting Diodes (TRMAR LED) by Scanning Thermal Microscopy (STHM), JPL (2003).
24. X.Guo,  G.D.Shen, Y.Ji, X.Z.Wang, Balk, Ludwig J. Heiderhoff, Ralph,Lee, Teck Hock et al, Thermal property of tunnel-regenerated multiactive-region light-emitting diodes, Applied Physics Letters 82 (25), 4417-4419 (2003).

2002
25. Y. Ji, D. Luo, X.D. Wang, Z.G. Li, Y.H. Sun, Z.J. Lu, Bin Zong, Y. Xia, G.H. Zhang, L.J. Balk and X.X. Liu, Evaluation of Microstructure and Stress of Cu Damascene Interconnects Using SPM, Proc.23th International Conference on Microelectronics (MIEL2002) V2: 781-783, Nis, Yugoslavia, 12-15 May (2002).
26. Lee TH, Guo X, Shen GD, Ji Y, et al., Investigation of Tunnel-Regenerated Multi-Active-Region Light-Emitting Diodes (TRMAR LED) by Scanning Thermal Microscopy(SThM) , MICROELECTRONICS RELIABILITY 42 (9-11): 1711-1714(2002).

2001
27. Yuan Ji, Ziguo Li; Dong Wang; Yaohai Cheng; Dong Luo; Bin Zong, Scanning thermal microscopy studies of local temperature distribution of micron-sized metallization lines, Microelectronics Reliability 41 (8): 1255-8 (2001).
28. Y. Ji, T.X. Zhong, X.X. Gao, D.Luo, H. E. Li, D.M. Chen, X.F. Wang,and Li Han, Scanning thermal microscopy Evaluation of interface thermal Property of composites for electronic packaging, Journal of Trace and Microprobe Techniques 19 (3), 365-372 (2001).

2000以前
29. Ji, Yuan, Zhong, Taoxing; Gao, Xiaoxia; Shi, Ning; Cui, Yan, Scanning thermal probing of interfacial thermal conductivity of metal matrix composites, Journal of Materials Engineering 12 (41): 29-31 (2000).
30. Y. Ji, X.X. Gao, T.X. Zhong, Formation and microstructure of an in-situ aluminum composite by oxygen spray technique, Journal of Materials Engineering and Performance, 8 (2), 168-170 (1999).
31. Weiling Guo, Zhiguo Li, Hong Zhu, Wei Zhang, Yuan JI, Yinghua Sun, Guangdi Shen, Temperature gradient impact on electromigration failure in VLSI metallization, Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 122-127 (1998).
32. T.X. Zhong, Y. Ji, Y. Li, W.M. Mao, H.E. Li, Processing and Microstructure of an in-situ
  Aluminum composites obtained by rotative blowing, Material Science and Technology,
  5 (2), 85-88 (1997).
33. Y.Ji, T.X. Zhong, Y.Wang, J.Z. Tang, X.X. Dong, Microstructure of in-situ Al2O3 /Al composites, Journal of Trace and Microprobe Techniques, 15 (4), 489-492 (1997).
34. Y.Ji, Z.G. Li, W. Zhang, Y.H. Sun, Y.H. Cheng, W.L. Guo, Observations and measurements on a multilevel matallizations system using backflow effect, Journal of Trace and Microprobe Techniques 15 (4): 485-488 (1997).
35. X.X. Li, W. Zhang, Y. Ji, et al., Increase in electromigration resistance by enhancing backflow effect, 30th annual proceedings, Reliability physics: 211-216 (1992).
36. Yuan Ji, R. Senkel, L. Reimer, et al., Recording of magnetic contrast type-I by a two-detector system, scanning 9, 249-256 (1987).